Sorry for uploading many questions today.
I have things to confirm about thermal resstance.
As for the thermal resistance section of ADP2118's datasheet,
θ JA is measured using natural convection on a JEDEC 4-layer
board, and the exposed pad is soldered to the printed circuit
board with thermal vias.
---> what is the natural convenciton on a JEDEC 4-layer? What are JEDEC material we can reffer to?
#2, I think a JEDEC 4-layer board does not have thermal via spec.
Is it normal to mesure θja with therml vias for JEDEC 4-layer board?
#3, ADP2441's datasheet does not menton "thermal via" compared to ADP2118.
(Please take a look at the attached file)
I'd like to make sure if JEDEC 4-layer board for ADP2441 has thermal vias or not?
If it has not vias, is there any specific reason?