Device I am using is...
BF518 - 168-Ball CSP_BGA; rated @ TAMBIENT = –40°C to +85°C; running at 240MHz clock with 1.37V internal supply.
The module this chip is designed into sees an ambient of 105C. Internal to external temp rise within this module has been measured at 5C meaning the BF518 device sees an ambient temperature of 105+5 = 110C with no airflow. Calculations show a power dissipation of 160mWatt in the BF158 resulting in a junction to internal ambient rise of 5C (using 30.5C/W from table 51 of data sheet) meaning the junction could rise as high as 115C!
What are the ramifications of exceeding the absolute maximum junction temperature of 110C called out in Table 17 of data sheet? Are there any particular parameters at higher risk of degradation?