ADE7953 Single Phase Energy Metering IC PAD question.
From the datasheet:
Exposed Pad. Create a similar pad on the PCB under the exposed pad. Solder the exposed pad to the pad on the PCB to confer mechanical strength to the package. Do not connect the pads to AGND.
From Evaluation Board User Guide (UG-194.PDF) :
in the Schematic and on the board PAD is connected to the AGND pin and DGND pin.
Both Analog Devices official documents with different pin connections.
What is best?