I would like to use ADCMP582.
So, I have a question. Please help me.
Please tell me about correct handling of Exposed pad.
The following statement is on page 8 of data sheet.
Although the description about Exposed pad is only in this part,
As a recommended process, is the floating state correct?
If you need to dissipate heat, is it OK to connect the pad to GND?
Because the examination circuit of this time is ultra high speed, concern about pin processing is concerned due to the influence of electrostatic capacity.