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HMC1110 GaAs MMIC X6 FREQUENCY MULTIPLIER

Question asked by andreamucchietto on Jul 10, 2018
Latest reply on Jul 11, 2018 by andreamucchietto

 1 - Bond pad is specified to be 3.3 mm^2. Nominal size of the whole die is 2.44mm x 1.35mm = 3.294 mm^2. Would anyone know where the error is in the datasheet? Looking at the schematics from the datasheet I was expecting the pad area to be approx. (0.075mm)^2.

2 - Could this device work at temperatures lower than the specified limit -55°C ? From measurement plot (in datasheet) output power as function of temperature is still quite stable at -55°C.

 

Thank you for your attention,
Andrea Mucchietto

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