1 - Bond pad is specified to be 3.3 mm^2. Nominal size of the whole die is 2.44mm x 1.35mm = 3.294 mm^2. Would anyone know where the error is in the datasheet? Looking at the schematics from the datasheet I was expecting the pad area to be approx. (0.075mm)^2.
2 - Could this device work at temperatures lower than the specified limit -55°C ? From measurement plot (in datasheet) output power as function of temperature is still quite stable at -55°C.
Thank you for your attention,