What is the maximum downward pressure that can be applied to the top of BGA packages?
Can you please share why you are looking for this information.?
AD9361 is a CSP_BGA package with plastic top cover. Heat dissipation is mainly through the BGA balls and not through the Top plastic.
I still need to have heat sink attached.
would you inform me what is the maximum downward pressure that can be applied to the top of BGA packages?
ADI does not have test data or spec for maximum pressure/force on package.
As a rough estimate, Using assembly lid attach process as a reference, <1.0kgf should be safe for BGA.
I like to know one more thing.
In the datasheet of AD9361, θjc is smaller than θjb. is this θjc θjc-bottom or θjc-top?
why is θjc smaller than θjb if heat dissipation is through BGA ball?
I guess the Case mentioned here is case below the die and not the plastic case.
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