1.Temperarture scals issue with different package
We are now designing AD5560. For the package issue, we are confused about BGA and TQFP.
As we read from datasheet, we think 3 hot points are shown in the BGA package. But the scale of Temperature is unclear in ours views. Could you help to explain which package is most popular for our applicaton(per board over 4-6 chs). Thank you very much.