Here at Pacific, we are following up on bond wire materials due to processing issues, and would like to know the material content of the mentioned IC's (and specific date codes if possible).
Sorry for the delay. This query has been moved to the Precision Converter space.
The material content can be checked in the material declaration page.
With regards to the bond wire material, can you give more details on the processing issue encountered? Have you send the devices for failure analysis?
Retrieving data ...