I was reading datasheet.
There was theta JA value at datasheet.
But there is no theta JC value.
Can you tell us theta JC value for each package?
This data is just for SOIC_W. For SOIC_N, it is 42C/W typ. We do not find the one for QSOP yet. but definitely it should be larger than SOIC_N.
Hi Kawa - we're researching this and will get back to you ASAP.
The ThetaJC on side 1 is 33 C/W typ, while on side 2 is 28C/W typ.
Thank you for your reply.
Would the value will be same between soic and qsop?
42C/W for which side?
Side1 ? Side2?
42C/W include both side thermal resistance in it.
I understood that you have data for SOIC_W side1 and side2.
Also I understood SOIC_N side1 and side2 value are same.
Is my understanding correct?
For SOIC_N, it is already consider both sides, only total power dissipation is needed to calculate temperature rise.
For SOIC_W,it is more accurate, power dissipation on both sides are needed.
This is my last question.
I think supply current will be same.
Why did you made different theta Jc between SOIC_N and SOIC_W?
thermal resistance is used to determine how well the package could transmit the heat to outside. As package is the path of heat, different package size will have different thermal resistance.
I don't know why this discussion is close but it is not close.
As I asked, can you tell me why did you separate SOIC_W side1-2 specification and didn't separate SOIC_N?
sorry for not response quickly. there is no specific reason. traditionally we specify thetaJC for SOIC_W is seperated. 16 leads SOIC_N is not that widely used, its simulatio model is not unified with SOIC_W.
I want know why did you separate soic w and did not separate soic n.
Retrieving data ...