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Surface mount assembly recommendation for the BGA Package of the BF707

Question asked by Michael.S on Feb 9, 2018
Latest reply on Feb 21, 2018 by Jithul_Janardhanan

In the datasheet of the BF70x Family at page 114 the package ball attach type is solder mask defined (SMD). Is this the recommendation from analog devices for most applications?

I'm asking because of the different basic designs with non solder mask defined (NSMD) or solder mask defined (SMD)? At my FPGA spec there is NSMD recommended.

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