Hi ADI Expert,
Customer’s board use ADV7630 but they have encountered some reliability issue when go Mass production.
This issue seems relative to soldering but customer is not sure and want to find the root cause.
According to Q6 in EE-352, it mentioned that “total void area must be less than 50% of the EPAD *AND* no more than 50% of the vias to the GND plane should be in a void.”
Is above description an necessary condition when we soldering EPAD?
What’s the potential risk if more than 50% via are in a void?