In the datasheet at ADM7171,
Figure 63 to Figure 65 show junction temperature calculations for different ambient temperatures, power dissipation, and areas of PCB copper.
I wonder that why total power dissipation data in Figure 64 and Figure 65 differrence from in Figure 63, at same 500mm**2 area.
I think that, for different ambient temperatures, same areas of PCB copper, the result data is same slop, different Intercept, and shift the graph up or down.
Is it like the data at 100mm**2 area ?
Is it incorrect ?