I was hoping to get more information on bonding of these components. I work to NASA 8739.1 polymeric standards and they are very specific as to how thermistors, PRT and similar components should be attached. I'm a little confused as to what category AD590 fall into. They are flat pack IC's so they differ from traditional platinum resistance types which NASA says at least one lead shall not be embedded in the bonding material. So where you say above to use glue there is a little more to the story than just applying and setting in place. I was hoping to get a discussion going to find out what is considered an acceptable aerospace bonding method for these components.