AD590:  Which side of ceramic flatpack of AD590JF should be connected to the object whose temperature I wish to measure?

Q 

 I am using a  thin layer of thermal epoxy to attach the AD590JF to the host
component but it is not clear to me what is the optimal attachment side to use
on the sensor?

 

A 

For the AD590JF, the die is in direct contact with the ceramic base and not the
metal lid. The component should have the ceramic side in good thermal contact
with the object whose temperature you wish to measure. You can either clamp the
temp sensor or use glue. The glue must be pliable and thermally conductive.
Thermal epoxy for example
Comments
Anonymous

  • I was hoping to get more information on bonding of these components. I work to NASA 8739.1 polymeric standards and they are very specific as to how thermistors, PRT and similar components should be attached. I'm a little confused as to what category AD590 fall into. They are flat pack IC's so they differ from traditional platinum resistance types which NASA says at least one lead shall not be embedded in the bonding material. So where you say above to use glue there is a little more to the story than just applying and setting in place. I was hoping to get a discussion going to find out what is considered an acceptable aerospace bonding method for these components.

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