I am using a thin layer of thermal epoxy to attach the AD590JF to the host
component but it is not clear to me what is the optimal attachment side to use
on the sensor?
For the AD590JF, the die is in direct contact with the ceramic base and not the
metal lid. The component should have the ceramic side in good thermal contact
with the object whose temperature you wish to measure. You can either clamp the
temp sensor or use glue. The glue must be pliable and thermally conductive.
Thermal epoxy for example