We do not have characterization/test data related to the DS600 thermal response.
However, bench testing (using a heat gun) shows that there is less than 1 second lag between applying a new temperature and getting a VOUT response. The thermal sensor in the DS600 uses two matched transistors. As the temperature changes, we expect the voltage across the transistors to change proportionally and thus we get a voltage difference that can be adjusted to meet the required accuracy specifications. The results obtained for the conversion cycle suggest that it shouldn’t be more than 500ms, as the die is exposed to changes in temperature, we can expect a ‘fast’ response to that voltage difference seen across the internal transistors.