As per File: without spi isolator.pdf
1) Use one DC-DC to generate 3.3V_AGND with ground labeled as AGND.
2) Use second DC-DC to generate 3.3V_DGND with ground labeled as DGND.
3) This configuration is simple and my component count is also less.
Now my question is that Is galvanic isolation present between Micro_controller and LTC2984?
As per File: with spi isolator.pdf
1) Use one DC-DC to generate 3.3V_AGND with ground labeled as AGND.
2) Use second DC-DC to generate 3.3V_DGND with ground labeled as DGND.
3) In this place another component spi isolator for galvanic isolation
Now my question ..is first configuration ok? or I have to use second one ? My priority is galvanic isolation.