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SEE test results report and related information for AD5270BRMZ-100

Thread Summary

The user inquired about BPSG presence, process size, SEE testing, and related parameters for the AD5270BRMZ-100. The final answer confirmed the die is silicon-based with a 0.6um process size, and no SEE testing was performed. The user requested clarification on BPSG usage for SEE analysis.
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Category: Hardware
Product Number: AD5270BRMZ-100
I would like to get the following information related to AD5270BRMZ-100

1) Is Boro Phospho Silicate Glass (BPSG) present in die?
2) What is the process size?
3) Are these parts SEE tested?
4) Please provide the test location and beam information.
5) What is the test temperature environment?
6) What is the worst case angle of incidence for applied beam?
7) How many units were tested for each part number?
8) What is the applied fluence during test?
 
Additionally, please share the SEE test result report for more details.
  • Hello  ,

    Sorry for the delayed reply. Here are the answers to the above questions:

    1) Is Boro Phospho Silicate Glass (BPSG) present in die? - Die is mainly silicon
    2) What is the process size? - 0,6um
    3) Are these parts SEE tested? - No
    4) Please provide the test location and beam information. - EOL test is ASE Taiwan, no SEE test location
    5) What is the test temperature environment? - EOL test ambient ~25°C
    6) What is the worst case angle of incidence for applied beam? - no SEE test
    7) How many units were tested for each part number? - 100% parts are tested in end of line in production, 
    8) What is the applied fluence during test? - Not clear what you mean. If it is a SEE parameter, then it is N/A

    Kind regards,

    Stanca

  • Hi Stanca, Thank you for replying. On the first question, I meant if the internal semiconductor‐die uses BPSG (boro-phospho-silicate glass) for interlayer dielectric or passivation or not. I need this data for SEE analysis. Please give me details.