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The ADG1206 and ADG1207 are monolithic iCMOS® analog multiplexers comprising sixteen single channels and eight differential channels, respectively. The...
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ADG1206 on Analog.com

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Thermal Resistances for ADG1206 (32-Lead LFCSP)

		
	
				

			

									
					    crdufour
					
							

            
            			
				
									
											
			
			
				
			
			
			    	
			                    
                
				                on Jun 9, 2026 
				
			
			
		

		
		                    	    

        	    
Thread Summary

                The user asked for thermal resistance values for the ADG1206 part, specifically θ_JC-top, θ_JC-bottom, θ_JB, Ψ_JT, and Ψ_JB. The final answer provided these values based on package thermal simulation data: θ_JC-top = 33.1°C/W, θ_JC-bottom = 8.63°C/W, θ_JB = 24.28°C/W, Ψ_JT = 0.89°C/W, and Ψ_JB = 24.39°C/W. These values are for a 2s2p board with 9 thermal vias under still air conditions and are for reference only, not guaranteed specifications.
                        	    

                
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Category: Datasheet/Specs

    		        		            		    
Product Number:  ADG1206  

    		        		    		    

		    		    
		    			

			    
Can you provide the thermal resistance values for this part?


    

  • Junction to Case (Top) Thermal Resistance
    • 

  • Junction to Board Thermal Resistance
    • 

  • Junction to Case (Bottom) Thermal Resistance
    • 

  • Junction to Case Thermal Characterization Parameter (Psi)
    • 

  • Junction to Board Thermal Characterization Parameter (Psi)
    • 



I was able to locate the junction to ambient in the datasheet, but not the other values.




 


Product Page: https://www.analog.com/en/products/adg1206.html 


Datasheet: https://www.analog.com/media/en/technical-documentation/data-sheets/ADG1206_1207.pdf 


Drawing for 32-Lead LFCSP: https://mds.analog.com/api/public/content/CP_32_7.pdf 

			

			
									
		                             
                        

    

                                            
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    •  Analog Employees  
    
            
						
                            
            
            				
            
                on Jun 16, 2026 10:51 PM
            
            
												
						in reply to Geloism16
					
										
			            		
    
		
										+1
					
	
    

		
		
    
		
    
                                
                                                            
    
					
    Hi  ,
    

    

    

    Below are the thermal parameters based on package thermal simulation data:
    

    

    


    
Parameter
Symbol
Value

    

    
Junction to Case (Top)
θ_JC-top
33.1°C/W

    

    
Junction to Case (Bottom)
θ_JC-bottom
8.63°C/W

    

    
Junction to Board
θ_JB
24.28°C/W

    

    
Junction to Top Characterization (Psi)
Ψ_JT
0.89°C/W

    

    
Junction to Board Characterization (Psi)
Ψ_JB
24.39°C/W

    
    

    

    

    The Ψ_JT, Ψ_JB, and θ_JB values above are based on a 2s2p board with 9 thermal vias under still air conditions.
    

    Please note that these values are based on thermal simulation and are provided for reference only. 
    

    They are not guaranteed specifications and should not be used as final design parameters.
    

    Regards,
    

    Gelo
    

    
			
    

		
			
	      

		
		
	
    
	
    
		
    
			
		
    
	
    
	
    
		
						
						
						
						
				
				
		
		
    
			
		
    
	
    

    

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