Thermal Resistances for ADG1206 (32-Lead LFCSP)

Question

Can you provide the thermal resistance values for this part? 
 
 Junction to Case (Top) Thermal Resistance 
 Junction to Board Thermal Resistance 
 Junction to Case (Bottom) Thermal Resistance 
 Junction to Case Thermal Characterization Parameter (Psi) 
 Junction to Board Thermal Characterization Parameter (Psi) 
 
 I was able to locate the junction to ambient in the datasheet, but not the other values.

Product Page: https://www.analog.com/en/products/adg1206.html 
 Datasheet: https://www.analog.com/media/en/technical-documentation/data-sheets/ADG1206_1207.pdf 
 Drawing for 32-Lead LFCSP: https://mds.analog.com/api/public/content/CP_32_7.pdf

Geloism16 · Accepted Answer

Hi crdufour ,

Below are the thermal parameters based on package thermal simulation data:

Parameter 
 Symbol 
 Value

Junction to Case (Top) 
 &theta;_JC-top 
 33.1&deg;C/W

Junction to Case (Bottom) 
 &theta;_JC-bottom 
 8.63&deg;C/W

Junction to Board 
 &theta;_JB 
 24.28&deg;C/W

Junction to Top Characterization (Psi) 
 &Psi;_JT 
 0.89&deg;C/W

Junction to Board Characterization (Psi) 
 &Psi;_JB 
 24.39&deg;C/W

The &Psi;_JT, &Psi;_JB, and &theta;_JB values above are based on a 2s2p board with 9 thermal vias under still air conditions. 
 Please note that these values are based on thermal simulation and are provided for reference only. 
 They are not guaranteed specifications and should not be used as final design parameters. 
 Regards, 
 Gelo)

Parameter	Symbol	Value
Junction to Case (Top)	θ_JC-top	33.1°C/W
Junction to Case (Bottom)	θ_JC-bottom	8.63°C/W
Junction to Board	θ_JB	24.28°C/W
Junction to Top Characterization (Psi)	Ψ_JT	0.89°C/W
Junction to Board Characterization (Psi)	Ψ_JB	24.39°C/W

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Thermal Resistances for ADG1206 (32-Lead LFCSP)

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