Hi ADI Expert:
I saw a post which question "Why do I need to connect the Exposed Pad of the MAX14760, MAX14762, and MAX14764 to VN and not to GND?"
And the answer as stated:
The exposed pad (EP) must never be connected to ground (GND).
The EP is attached to the die substrate with conductive silver epoxy. The die substrate must be biased at the lowest voltage potential which is VN. The substrate will self-bias to VN, so it is possible to leave the EP unconnected, but preferred to connect to GND as the product datasheet recommends.
I'm confuse on the answer. The first line mention EP must never connected to ground (GND).
However, the last sentence mention preferred connect to GND as the product datasheet recommends.
At this moment, i use MAX14764 per my application as listed:
I use this MUX for SPDT for 2 type of signal:
1. 1PPS: 0 ~ 5V CMOS signal
2. Sinewave 10MHz, -2.5V ~ +2.5V signal.
VCC connected to 3.3V.
VP: Bypass VN to GND with a 0.1μF 50V ceramic capacitor placed as close as possible to the device.
VN: Bypass VN to GND with a 0.1μF 50V ceramic capacitor placed as close as possible to the device.
GND: GND (baseboard GND)
EP: SG (baseboard GND) but not VN
About EP, do i really connected to VN instead of GND?
At this moment, i just gerber out my board design, if this is critical change needed, i need to pull back my gerber asap.
Please help to provide comments asap.Thanks.
