ADG1436 with LFCSP Package.

Hi AVESD,

The 260 °C is already the maximum temperature. Beyond this may cause permanent damage to the device. This temperature should be enough to reflow the IC as you can see in the Figure 15 below. I got this figure on page 7 of AN-772 which is a guide for design and manufacturing of LFCSP. Have you tried pre-heating the board and adding flux during reflow? 

Regards,

Yoworex

Hi, and thank you for the quick response.

As shown in the figure, I followed your advice and preheated the board. I preheated the board for about 4 minutes, and the reflow took about one minute, not exceeding 260C

I noticed pins 1-2 and 9-10 are reading high impedance, something in the order of 5 to ~10 Mega ohms. The devices measure ∞ infinite resistance in pins 1-2 and 9-10 before the rework. The pads in the board also read infinite without components. I wonder if this is a normal condition for the device to read high impedance after the rework or if they are getting degraded.

Please advise.

Hi AVESD,

Pin 1 = D1, Pin 2 = S1B, pin 9 = D2, & Pin 10 = S2B. These pins should be high impedance when the switch is not powered, not enabled, or the channel is not selected. 

Try the test setup below and see if there are abnormalities like drawing too much supply current, channel not switching, and etc. 

Regards,

Yoworex

Thanks a lot.

I will give it a try. Just to make sure, if I probe pins 1 with pin 2 and pin 9 with pin 10 without any power it should read high impedance, correct?

Hi AVESD,

Yes, you should see high impedance in those pins. In no power condition, the switch channels (SxA to D or SxB to Dx) should have high impedance. 

Regards,

Yoworex

Hi AVESD,

Yes, you should see high impedance in those pins. In no power condition, the switch channels (SxA to D or SxB to Dx) should have high impedance. 

Regards,

Yoworex