Hi,
The ADG5419 has a nice enable feature but only in the LFCSP package (kind of a DFN package).
In the MSOP package, the enable seems to be just not bonded from the chip to the lead frame.
This is very unfortunate, as this enable feature is really advantageous, but the LFCSP package cannot be used in applications which do not tolerate the lower reliability versus temperature cycling of the no-lead packages.
I understand that there are reasons for leaving pin 5 unconnected for compatibility issues with existing switches, but just not offering the feature in the MSOP package seems not to be the brightest idea.
Also having the same part number but different functionality in different packages is quite confusing.
Is there a comparable part that has both, the enable feature and a gull wing package?
Or could ADI make available a version of the ADG5419 that has enable bonded to pin 5 of the MSOP package? There would be virtually no additional production cost as one additional wire bond should be negligible. Of course there is also cost associated with introducing a "new" part and maintaining it, but there would also be additional revenue.
Best Regards,
Gerd
