Thermal data of AD8159ASVZ

Sorry for the delay in response. The AD8159 is in the same product family as the AD8152. You can refer to the latter datasheet for thermal parameters, on page 8. Copied the excerpt below.

MAXIMUM POWER DISSIPATION The maximum power that can be safely dissipated by the AD8152 is limited by the associated rise in junction temperature. The maximum safe junction temperature for plastic encapsulated devices is determined by the glass transition temperature of the plastic, approximately 150°C. Temporarily exceeding this limit may cause a shift in parametric performance due to a change in the stresses exerted on the die by the package. Exceeding a junction temperature of 175°C for an extended period can result in device failure.

Sorry for the delay in response. The AD8159 is in the same product family as the AD8152. You can refer to the latter datasheet for thermal parameters, on page 8. Copied the excerpt below.

MAXIMUM POWER DISSIPATION The maximum power that can be safely dissipated by the AD8152 is limited by the associated rise in junction temperature. The maximum safe junction temperature for plastic encapsulated devices is determined by the glass transition temperature of the plastic, approximately 150°C. Temporarily exceeding this limit may cause a shift in parametric performance due to a change in the stresses exerted on the die by the package. Exceeding a junction temperature of 175°C for an extended period can result in device failure.