For a research project at work we opened LTC6240HV Operational Amplifiers to expose the die, inject disturbances and analyse the output signal.
My bachelors thesis is about a more in depth analysis of the measured output signals. For a proper understanding and discussion why the chip is more sensitive in some areas and less sensitive in others I would need information on which structures on the bare die correlate to which part of the simplified schematic stated in the datasheet.
Does anyone have any more information on this or can give me an educated guess?
Thank you in advance!