How can I determine the die temperature of your device?
Could you kindly let us know what difference with AD2428WCCSZ and AD2428WCCSZ01?
Our customer use AD2428WCCSZ01 first, but they want to modify to non-automotive version, but AD2428BCPZ no die revision, they confuse about it.
Where can I get the S parameter of LNA HMC341 measured on die? The S papameter offered on website is the results measured on test board.
Do you have a maximum power consumption for the HMC598 in die form? The data sheet shows 175 mA @ 5 volts, but it's only a typical number and I'm seeing 220 mA @ 5volts, with no input signal or output load. Thanks.
I wanted to Simulate the HMC392A in Microwave office. So i downloaded its S2P file from design resources and as i performed simulation its responses like return loss is better than the datasheet but its gain is decreased to max15.7 dB after simulation…
I am conducting thermal analyses in Ansys Icepak on a board with some HMC6981LS6 amplifiers on it.
To properly model the amplifiers, I need to know the dimensions of the die, the die attach and the die pad, which I couldn't find on the datasheet…
Currently we are using ADG5206 (LFCSP_WQ package) and we are looking for ways to decrease the required footprint per channel. One way would be using bare dies. As there is a list of "as bare die" available products ( http://www.analog.com…
Do you sell this amplifier as a bare die, without the package?
Thank you in advance,