• RE: Questions for HMC902-Die

    Hi Keiichi,

    PArt no for the 100 pF CARP we used for this case is D15BV101M1BX. In general there is no critical parameter for that SLC, you can suggest a SLC from vendor like ATC, AVX, Murata, or any vendor similar to these.



  • Question about Bare Die Pick Up Tool

    Hi All,

    Would you le me know recommended pick up tools (vacuum collet and a pair of bent tweezers) for HMC902-Die? 

    It's my first time to handle such bare chip.




    See gerber files attached for HMC902 and HMC408.

  • RE: HMC8410 Vgg voltage range

    Ok and thanks for your help.However I found that the chip HMC902 Vgg can setted 0V for 80mA Idd

  • RE: hmc902LP3E的第14引脚怎么时接地的啊?


  • MSL rating of HMC902 & HMC903?


    What is the MSL rating of HMC902LP3E and HMC903LP3E? I can't find the MSL rating in the datasheets, and the parts do not have Material Declaration documents on the website.

  • ESD rating of HMC902

    Dear Sir/Madam,

    Our customer asked as following matter.

    What is your ESD ratiing of HMC902?

    As for similar product HMC903 show as "ESD Sensitivity (HBM) Class 0, Passed 150V" on your datasheet Abs Max Ratings.

    Thanks Kaos

  • HMC6981LS6 Die dimensions


    I am conducting thermal analyses in Ansys Icepak on a board with some HMC6981LS6 amplifiers on it.

    To properly model the amplifiers, I need to know the dimensions of the die, the die attach and the die pad, which I couldn't find on the datasheet…

  • RE: LT3080 Exposed Pad Is Soldered to Ground by Mistake

    The bottom of the LT3080 die is supposed to be a resistive version of the OUT pin.  I say “supposed to be” because in reality there is a thin layer of unavoidable but inadvertent oxide between the die silicon and the exposed pad metal.  That…

  • HMC341 die

    Where can I get the S parameter of LNA HMC341 measured on die? The S papameter offered on website is the results measured on test board.