• Packaged Part Numbers

    Are these the correct packaged part numbers for the following die products?
    HMC913-Die = HMC913LC4B
    HMC907A-Die = HMC907APM5E

    If so, where can I locate the schematics for following evaluation boards?
    EVAL-HMC913LC4B
    EVAL-HMC907APM5

  • AD825 die backside connection

    I have no indication on Backside connection.
    Which potential should I connect the backside of the AD825 die?

     

    You should not connect die backside. Please let die backside float.
  • HMC659-Die S-parameters

    Hello,

    Please share S-parameters of HMC659-Die.
    S-parameters of HMC659-Die cannot be found in ADI web site.

    Is using HMC659-Die with Vdd=5V Idd=100mA possible (recommended)?

    Best Regards,

  • RE: HMC948 Enable Pin and Package

    hi Eike,

    Pin 12 is a not connected internally.

    There's no die version of HMC948. HMC611 is available in die, but up to 10ghz.

    -andy

  • HMC347A-Die v.s. HMC347B

    Hi all,

    Our customers have used HMC347.
    They will consider choosing a replacement product as the stock purchased at the last time buy will be gone.
    HMC347A-Die and HMC347B are both dies, and there is a difference between suffixes A and B.
    I do not know why…

  • AD7124-8 as a bare die

    Hi, 

    I intend to use AD7124-8 for my application. Could you please confirm if this part is available as a bare die ? 

    Regards,

    Sakthivel 

  • HMC588LC4BTR two die code

    I bought HMC588LC4BTR   from Arrow on line  1805+  and another Chinese agent 1812+,

    because there is somthing differences on the labels 

    Therefore, I have tested the goods through the white horse inspection agency in China and the AAA inspection agency in the…

  • RE: HMC505LP4 as naked die

    In cases where bare die is not currently offered for a product, a very strong business case is required. Additionally,  product not originally intended for sale as bare die, may not be configured for RF probing (no pads for GND-SIG-GND) so unless the die…

  • RE: Mixer in die form

    This question has been assumed as answered either offline via email or with a multi-part answer. This question has now been closed out. If you have an inquiry related to this topic please post a new question in the applicable product forum.

    Thank you,
  • RE: Die structure in OpAmps

    This question has been assumed as answered either offline via email or with a multi-part answer. This question has now been closed out. If you have an inquiry related to this topic please post a new question in the applicable product forum.

    Thank you,