• RE: Pluto SDR in Ethernet Adaptor Mode Randomly Has Adaptor Die

    Hi all,

    I would really like an answer to this question. Since I am experiencing it, I know others have likely experienced it too.

  • LTC6268 Bare Die Pad Layout

    Hello,

    For a research project I am working on I need to use the LTC6268-10 op-amp. In my project I need to reduce the parasitic capacitance as much as possible. As a result, I am trying to get bare-die of this op-amp and directly wirebond it to another…

  • OP293: Available as bare die

    I require an op-amp with a fairly basic electrical spec but it must be
    available in die form for incorporation onto a microwave substrate in a sealed
    module.  It must operate from a single +5v supply and the input voltage range
    should extend down…

  • ADA4530-1 Die level option

    Hi,

    Is it possible to get ADA4530-1 amplifier with die level "package"?

    If not, what is then the best amplifier with die level package if the critical parameters are:

    - IBias under 1pA and offset voltage as low as possible (this will be use…

  • AD825 die X-Y coordinate

    What is the size of the die in X-Y coordinate?

     

    See attachment.
    Attachments:
  • Information about REF43NBC Die part

    Is the Lifecycle status for Die part “(REF-43(1802Y)” and the REF43NBC the same?

    Can you please give me the lifecycle status for REF-43(1802Y.

     

    1802Y is the dice’s mask set ID and the part that customers can order is the
    REF43NBC…

  • Handling die for HMC650-658

    Hello, I have questions from customer for the die handling. Q1 Is passivation film on the side of trace and pad? Q2 Do HMC650-658 devices need mold sealing after mounting and bonding? In other word, is any problem for the electric characteristic and …

  • Question ADuCM320 LV Die interrupt

    Hi there, 

    I have questions about LV Die interruot configuration.

    According to user manual,

    It says"there is a delay period required after writing to INTCLR before the associated status bit in the INTSTA register is updated."

    My questions…

  • HMC-ABH241 : Die Related- Queries

    Find both Q&A below. 

     

    1. We only show decoupling for one side of the die. The top side in the view
    below has the same supply pads. Is decoupling only on one side required and can
    it be either side?
    Yes the supplies only on south or north…

  • AD8015 die-bonding best practices

    Hello,

    I'm laying out a TO package using the AD8015, and I have a few questions about some recommendations in the data sheet:

    1. On pg. 3, under the metallization photograph, there's a note that says "for best performance attach package substrate…