• HMC347B and HMC641A Bond Pad Metallization


    Can you please provide the Bond Pad Metallization for HMC347B and HMC641A Die? I cannot locate this information in the Datasheets.

    Thanks in advance,


  • RE: HMC641A-DIE datasheet specification

    This question has been assumed as answered either offline via email or with a multi-part answer. This question has now been closed out. If you have an inquiry related to this topic please post a new question in the applicable product forum.

    Thank you,
  • LTC38xx in Bare Die package

    Are any of the DCDC controllers in the LTC38xx family available in bare die package form?

    Especially the LTC3891 would be useful and fit the application. But other controllers in the same product segment would probably work, as long as they are available…

  • ADRF5424 Die Form


    Is ADRF5424 available in die form?

    What does Die on Carrier means?

    Thank you.

  • HMC-797-Die which Bias tee

    Hi, I'm using the HMC-797 die version. I implement the following scheme, for using this amplifier in the frequency range 500MHz-18GHz, but unfortunately it shows a very poor flatness and very low gain at high frequency. My doubt is on the bias tee I used…

  • HMC797A-Die


    Is it possible to maintain RF ON while the amplifer is OFF?

    Thank you so much


  • ADRF5044 DIE

    Is this product available in DIE form?


  • ADPA 7008 and ADPA 7009 die attachment

    We would like verify the die attachment method for ADPA 7008 & 7009 is epoxy.

    Is there anything in particular we need to use? Any brand suggestions or recommendations?

  • HMC-ABH241 : Die Related- Queries

    Find both Q&A below. 


    1. We only show decoupling for one side of the die. The top side in the view
    below has the same supply pads. Is decoupling only on one side required and can
    it be either side?
    Yes the supplies only on south or north side can…

  • DIE level parts?