• HMC392A-Die

    I wanted to Simulate the HMC392A in Microwave office. So i downloaded its S2P file from design resources and as i performed simulation its responses like return loss is better than the datasheet but its gain is decreased to max15.7 dB after simulation…

  • HMC6981LS6 Die dimensions

    Hello,

    I am conducting thermal analyses in Ansys Icepak on a board with some HMC6981LS6 amplifiers on it.

    To properly model the amplifiers, I need to know the dimensions of the die, the die attach and the die pad, which I couldn't find on the datasheet…

  • AD8515: Die size

    Are these dies AD8515 and OP284CHIPS smaller than 1 x 1 mm²? That would be an
    absolute max for us.

     

    1. The OP284CHIPS has a die size of 1.620 mm x 2.301 mm.
    2. The AD8515 has a die size of 0.660 mm x 0.920 mm.

    Therefore only the…
  • ADG5206 bare die

    Hi,

    Currently we are using ADG5206 (LFCSP_WQ package) and we are looking for ways to decrease the required footprint per channel. One way would be using bare dies. As there is a list of "as bare die" available products ( http://www.analog.com…

  • AD8354 bare die

    Hello,

    Do you sell this amplifier as a bare die,  without the package?

     Thank you in advance,

  • AD2428WCCSZxx die revision

    Hi

    Could you kindly let us know what difference with AD2428WCCSZ and AD2428WCCSZ01?

    Our customer use AD2428WCCSZ01 first, but they want to modify to non-automotive version, but AD2428BCPZ no die revision, they confuse about it.

  • AD825 die backside connection

    I have no indication on Backside connection.
    Which potential should I connect the backside of the AD825 die?

     

    You should not connect die backside. Please let die backside float.
  • HMC659-Die S-parameters

    Hello,

    Please share S-parameters of HMC659-Die.
    S-parameters of HMC659-Die cannot be found in ADI web site.

    Is using HMC659-Die with Vdd=5V Idd=100mA possible (recommended)?

    Best Regards,

  • AD9277 in die form?

    We would like to use AD9277 for a new design, an ultrasonic test equipment for
    material testing. High integration level and space saving are important aspects
    therefore the preferred component would be AD9277 in bare die (if available),
  • Die structure in OpAmps

    I would like to know what is the difference in the die structures of the following Op Amps

    • AD8620
    • AD8512
    • AD8513
    • OPA4227

    The main reason to know more about the die structures is to know how much the IC's will dissipate power supply current…