Hello,
Can you please tell me if there has been any changes to the internal bond connections or pin out for the HMC516LC5 device? I recently received a batch where pins 25,27,29, and 31 are now grounded. The NC pins on previous parts were internally…
When I soldered the chip to the board(PCB),Shorted pin Vcc and GND。
What is the minimum temperature for chip soldering?
In the datasheet HMC564 V06.1017 , the RF input power is described as 5dBm,
In the datasheet V08.0618, the value is +20dBm. Does that means we have two different kinds of HMC564 or it's just one clerical error? If there are two kinds…
Hi HM,
Unfortunately, we do not have the 2nd & 3rd harmonic data for these parts (or the IP2 data required to calculate this) at the moment.
Thanks,
Dan
I would like to ask why the results of S parameters of hmc564 in the datasheet and the the simulation results by S2p file are quite different.
Hmc564 datasheet:
Using ADS to import S2p file get result:
Is there anyone can help with this?
Appreciate.
您好,
我想问一下,为什么HMC564的S参数在芯片手册和s2p文件仿真得到的结果相差巨大。
HMC564芯片手册中
利用ADS导入s2p文件得到
发现两者相差巨大,7-14G手册中S11约为-20dB,而s2p文件得到的仅为-10dB,结果相差很大。
The largest temp range the DAC will operate per the data sheet is -40 to +85 C. If I get the die will it operate at -55 to 125C? I will be mounting the die on ceramic substrate.
does the assumption that it will work if properly heatsunk although the…
Please provide S-parameters for HMC939A-DIE. Thanks.
How can I determine the die temperature of your device?