The bottom of the LT3080 die is supposed to be a resistive version of the OUT pin. I say “supposed to be” because in reality there is a thin layer of unavoidable but inadvertent oxide between the die silicon and the exposed pad metal. That…
Where can I get the S parameter of LNA HMC341 measured on die? The S papameter offered on website is the results measured on test board.
How can I determine the die temperature of your device?
Do you have a maximum power consumption for the HMC598 in die form? The data sheet shows 175 mA @ 5 volts, but it's only a typical number and I'm seeing 220 mA @ 5volts, with no input signal or output load. Thanks.
The largest temp range the DAC will operate per the data sheet is -40 to +85 C. If I get the die will it operate at -55 to 125C? I will be mounting the die on ceramic substrate.
does the assumption that it will work if properly heatsunk although the…
I wanted to Simulate the HMC392A in Microwave office. So i downloaded its S2P file from design resources and as i performed simulation its responses like return loss is better than the datasheet but its gain is decreased to max15.7 dB after simulation…
Please provide S-parameters for HMC939A-DIE. Thanks.
09-13-17 Phased Array Webcast.pdf
Firstly if the HMC129 is going to be used for a new design then please be aware that this part is not recommended for new designs.
The 2 die are different due to a process change. The performance between the 2 die should be similar (isolation).…
Here is a response from folks within ADI who looked at your questions:
"They are comparing the old die revision to the new die revision material. The PCN effectivity date is only a marker to the earliest possible date of conversion and…