• RE: HMC462 Die RF Bond Pad Dimensions

    Hi Alex,

    Check this out.



  • RE: HMC641ALC4 vs ALP4 vs A-DIE frequency range ?

    Hi sss,

    Unfortunately, the lower frequency on the older HMC datasheets were incorrectly specified.
    We are correcting this as we convert the datasheet to the ADI-format.

    We have converted the HMC641A-DIE and the -ALP4 datasheet already, and will convert…

  • RE: HMC1087-DIE and HMC1087F10_1GHZ~2GHz RF performance

    Hi Josh,

    I do not think part is useful below 2Ghz at all. Can you check s2p files for both of these parts and see response below 2GHz.

    There is Gain dip around 1.4GHz. s2p files can be found at web

    https://www.analog.com/en/products/hmc1087f10.html a…

  • ADSP-21483 Die temperature limits and accuracy

    Dear support team,

    I am currently measuring the 'Die' temperature of my DSP device.

    I was wondering, how accurate the measurement using the THD+ and THD- pins is and whether there are certain limits.

    At the moment, we analyze the DSP behaviour…

  • ltc2641 die -

    The largest temp range the DAC will operate per the data sheet is -40 to +85 C. If I get the die will it operate at -55 to 125C? I will be mounting the die on ceramic substrate.

    does the assumption that it will work if properly heatsunk although the…

  • HMC939A-DIE

    Please provide S-parameters for HMC939A-DIE. Thanks.

  • Die Temperature

    How can I determine the die temperature of your device?

  • HMC341 die

    Where can I get the S parameter of LNA HMC341 measured on die? The S papameter offered on website is the results measured on test board.

  • HMC598 Die


    Do you have a maximum power consumption for the HMC598 in die form? The data sheet shows 175 mA @ 5 volts, but it's only a typical number and I'm seeing  220 mA @ 5volts, with no input signal or output load. Thanks.

    Best Regards.

  • HMC6981LS6 Die dimensions


    I am conducting thermal analyses in Ansys Icepak on a board with some HMC6981LS6 amplifiers on it.

    To properly model the amplifiers, I need to know the dimensions of the die, the die attach and the die pad, which I couldn't find on the datasheet…