Find both Q&A below.
1. We only show decoupling for one side of the die. The top side in the view below has the same supply pads. Is decoupling only on one side required and can it be either side?Yes the supplies only on south or north…
I am planning using the HMC-APH460-DIE in my project. I wanted to include the small signal behaviour in my system simulation. There is no available S-parameter file data available to download from the part website currently. I was wondering if there…
Our customer requests the channel temperature data of HMC-APH403-DIE. Could you please let me know ?
He compares HMC-APH403-DIE with a competitor. If he takes the data quickly, there is some chance of beating.
I am planning to use HMC-SDD112 switch for my project . There is no way to download the s-parameter file of that component. Can you please send me the S-Parameter touchstone file for that die.
Unfortunately, we do not have the 2nd & 3rd harmonic data for these parts (or the IP2 data required to calculate this) at the moment.
Do you offer or plan to offer 3D step models for the following Hittite products: the HMC-C032, HMC-C056, and the HMC-C058? Thanks.
I will use HMC-abh209 / HMC-alh382 / HMC-sdd112 in my design,
Would you please help to provide as below?
1. S parameter
2. Input R + jX
3. Output R + jX
4. Gerber file
Do we have the on wafer measured S-parameter file for the following Hittite Components :
Also I want to know whether these die are internally compensated or not for bond wire inductance.
I’m working on a design whichcontains several Hittite HMC-463 and HMC-ALH244 amplifiers (unpackageddie). Neither of these parts show a specification for second orderintermodulation in the data sheet. Can Hittite provide this information? Also, the HMC…
I don't understand very well the difference between HMC-SDD112 and HMC-SDD112-SX modules.
Is it about packaging?