How about HMC-abh209 and HMC-alh382?
Hello. I'm a system designer.
I'd like to use HMC-ALH382, HMC-ALH476, HMC598, HMC442 for making RF system.
Above chips need two voltage supplies, VDD and VGG.
When I read "MMIC AMPLIFIER BIASING PROCEDURE", VGG shoud be on befor VDD is on.…
I see in the datasheet for the HMC-ALH382 LNA that the bond pad width and gap are both 100 um (page 4), giving an effective pitch of 200 um. Would I be able to measure this device using 150 um GSG probes?
Our customer requests the channel temperature data of HMC-APH403-DIE. Could you please let me know ?
He compares HMC-APH403-DIE with a competitor. If he takes the data quickly, there is some chance of beating.
The HMC-C019 consists of 2 HMC547 die in series. As long as you optimized the layout for isolation there is no reason a PCB version of the HMC-C019 should not work as well.
Please create separate posts requesting die dimensions for the following products:
BTW, each datasheet has figures with die dimensions and bond pad locations.
Find both Q&A below.
1. We only show decoupling for one side of the die. The top side in the view below has the same supply pads. Is decoupling only on one side required and can it be either side?Yes the supplies only on south or north…
The HMC-C009 uses the HMC525 die. Best advice is to ensure the Phase length of IF! and IF2 are matched.