咱们专家在媒体论坛中举办了“集成式软件定义无线电”的技术讲座,介绍了将RF到基带的高速模拟信号链与FPGA数字信号处理相结合,可用于无线通信。话题涉及高速模拟信号链、直接变频无线电架构、高速数据转换器接口以及软件定义无线电中的FPGA数字信号处理。演示使用新一代的模拟器件高速数据转换器、RF和时钟器件以及Xilinx Zynq-7000 SoC。其它话题包括调制器/解调器导致的系统问题,特别是温度和频率变化造成的影响。探讨可以减少这类问题影响的工厂和现场算法,尤其是“一劳永逸”的工厂预制算法…
咱们专家在媒体论坛中举办了“集成式软件定义无线电”的技术讲座,介绍了将RF到基带的高速模拟信号链与FPGA数字信号处理相结合,可用于无线通信。话题涉及高速模拟信号链、直接变频无线电架构、高速数据转换器接口以及软件定义无线电中的FPGA数字信号处理。演示使用新一代的模拟器件高速数据转换器、RF和时钟器件以及Xilinx Zynq-7000 SoC。其它话题包括调制器/解调器导致的系统问题,特别是温度和频率变化造成的影响。探讨可以减少这类问题影响的工厂和现场算法,尤其是“一劳永逸”的工厂预制算法…
Dim,
let's start with the LDOs, which I assume you are running them from the 5V rail.
You could consider the ADP222 (dual 300mA) or the ADP323 (tripple 200mA).
The Linear Regulator design tool will help you with determine if these devices will…
咱们专家在媒体论坛中举办了“集成式软件定义无线电”的技术讲座,介绍了将RF到基带的高速模拟信号链与FPGA数字信号处理相结合,可用于无线通信。话题涉及高速模拟信号链、直接变频无线电架构、高速数据转换器接口以及软件定义无线电中的FPGA数字信号处理。演示使用新一代的模拟器件高速数据转换器、RF和时钟器件以及Xilinx Zynq-7000 SoC。其它话题包括调制器/解调器导致的系统问题,特别是温度和频率变化造成的影响。探讨可以减少这类问题影响的工厂和现场算法…
Hi Ymsk,
1) Theoretical, it is possible to connect the two converters in parallel to double the maximum load current. However, some modifications are needed to maintain load sharing and stability between the two converters and reduce input and output…
Hi Marc,
Hi Meir,
Thanks for using ADIsimPower Design Tools.
Yes you can use 0402 or 0603 or 0805 package for the signal components, the tool uses 0805 for easy board building. Size matters only for the power components like the bias capacitors and inductors…
Saurabh,
In general I would point you to the ADIsimPower tool for identifying your best options
Here are a few options for you in the meantime:
- For the 14.8V to 5V you can use the ADP2370 or the ADP2300 (1/2/3)
- For the LDO from 5V to 3.3V we have…
LTM8045 |
LTM8049 |
LTM4651 |
LTM4661 |
LTM4686 |
LTM4676 |
LTM4686-1 |
LTM4676A |
LTM4675 |
LTM4677 |
LTM4678 |
LTM8062 |
LTM8061 |
LTM8052 |
LTM8026 |
LTM8056 |
LTM8064 |
LTM8054 |
LTM8055 |
LTM4600 |
LTM4600HV |
LTM4608A |
LTM4604A |
LTM8032 |
Thanks Al
How big is the center hole that you use ?
I have made provision for a 5 mm hole in the middle of the pad so I can solder it. I also did what they have suggested in EE-352 and used an outer perimeter of small vias and tent them using solder…
I'm seeing intermittent junk-o-rama on the output from the FMCOMMS1 we just received. Sometimes it's perfectly clean with negligible residual FM, but presently it's a royal mess, with the test tone output spread 300khz wide. Probing the clock…