Find both Q&A below.
1. We only show decoupling for one side of the die. The top side in the view below has the same supply pads. Is decoupling only on one side required and can it be either side?Yes the supplies only on south or north side can be used; hence CAPs only one side.2. The main reason he’s asking is since he wants to use 2 of these in parallel to increase the total output power. Thus, something like this Caps on top of this oneCaps on bottom of this one3. Can we offer some expertise on combining in this manner? How to connect the RFIN/RFOUT?They will probably implement some coupler or Wilkinson type power combiner topology for power combining. That area is not our expertise, probably they now better than we do, and many literature on the web.4. We note the use of RFIN/RFOUT ribbon. He asked if he could use 2-3 bond wires instead as ribbon is not typical in their assemblies.I told him likely not as at these 55+GHz frequencies, the inductance and skin effect would likely be issues using bond wires. Even at 60 GHz, 2-3 bond wires can be used instead ribbon, it is possible. But there may be some performance changes. Performance given on the DS plots can be best matched by using DS configuration.