Is the junction-to-case (top) thermal resistance value available for the ADL8107?

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The junction to case-top thermal resistance for the ADL8107 was simulated at 196.6 degC/W. For devices like this which have a metal slug on the underside of the part, we typically do not provide this information because the junction-to-top thermal resistance is so high compared to the junction to case-bottom thermal resistance, 69degC/W in this case. This means that there is little value in adding a top-side heat sink to the device if you have the underside metal slug connected to a ground plane and PCB that provides a low thermal resistance path. Ideally, you would have vias through the board and a heat sink attached to the back side of the board. If you do something like this, then there is no real value in top-side heat sinking. https://www.analog.com/en/products/adl8107.html#overview

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ADL8107 : FAQ