ADL5322's nemesis?

I have measured up to 80 degC.

My measurement was made like this: I've covered ADL5322 with a thermally conductive pad

and pressed against it a thermometer (DS1721+) on another piece of PCB,

additionally fixed it with some adhesive tape. I closed the enclosure and I've been reading the

temperature from thermometer for a little more than one hour.

Taking into account thermal resistance "junction" to case (theta_JC in the datasheet,

equal to 28,5 degC/W) I estimate that the die itself had no more than ~125 degC,

so it seems I still have a 25 degC margin. This would suggest (even if my measurements

were fairly inaccurate), that heat is not the problem, assuming that there is nothing

else in the chip that could be damaged by not so much higher temperature...

I have measured up to 80 degC.

My measurement was made like this: I've covered ADL5322 with a thermally conductive pad

and pressed against it a thermometer (DS1721+) on another piece of PCB,

additionally fixed it with some adhesive tape. I closed the enclosure and I've been reading the

temperature from thermometer for a little more than one hour.

Taking into account thermal resistance "junction" to case (theta_JC in the datasheet,

equal to 28,5 degC/W) I estimate that the die itself had no more than ~125 degC,

so it seems I still have a 25 degC margin. This would suggest (even if my measurements

were fairly inaccurate), that heat is not the problem, assuming that there is nothing

else in the chip that could be damaged by not so much higher temperature...