I'm looking for recommendations for a heat sink on the HMC460LC5 eval board. The boards came with no heat sink attached, but page 9 of the data sheet says "The evaluation board should be mounted to an appropriate heat sink.". Do we have recommendations on a heat sink and/or recommended attachment methods?
In general, heat sinks used under HMC evaluation boards are Aluminum 6061 with Ni plating so they can be solderable to EVB backside. 1.27 mm thickness is widely used.
HMC460LC5 consumes 0.6 watts, and it has 3.5mm square ground paddle on the back for heat dissipation. So you may be good to go without a heatsink.