I'm looking at the thermal specs for the HMC641ALC4 and need some help with clarification of the parameters. On page 3 of the HMC641 data sheet it shows the following:
Thermal Resistance Channel to die bottom
Insertion Loss Path 201 °C/W
Terminated Path 321 °C/W
My questions are:
1.) Is the Insertion Loss Path 201 °C/W = to the path straight through the device?
2.) Is the Terminated Path 321 °C/W = to the path terminated to the internal resistor?
3.) What is meant by the Channel?
4.) How do I calculate the Die to Case temperature?