I am currently creating footprints to use in a board layout.
The suggested land pattern drawing for the LP3, LP4 & LP4C packages has a chamfer on 2 corners of the openings for the pins, but there are no dimensions for this.
Also, how much smaller than the mask opening for the Ground pad should the Solder Paste be.
The parts we are using are:
HMC241LP3, HMC311LP3, HMC349LP4C & HMC472LP4
Here are the dimensions you requested.
We have an application note on SMT assembly of our QFN components encapsulated in “LP” and “LC” style packages (see the link below). It contains the information on our recommendations for PCB land pattern and stencil design for the LP packages.