HMC1061 and HMC661 thermal resistance

Hi Ning,

Thermal resistance of junction to package bottom is enough for most of the characterisation because the total thermal resistance is dominated by the resistance to the bottom.

You can use these values:

- HMC661: 20C/W

- HMC1061 : 16C/W

Regards

Sinan

Hi Ning,

Thermal resistance of junction to package bottom is enough for most of the characterisation because the total thermal resistance is dominated by the resistance to the bottom.

You can use these values:

- HMC661: 20C/W

- HMC1061 : 16C/W

Regards

Sinan