Is it passible Wire bonding chips use like flip chip?

Question

Hello 
 I'm going to use HMC-ALH476, HMC442, HMC1081... such as employed wire bonding. 
 But I can't do that. cause don't have bonding machine... 
 I tried to find other way.... is it okay to use like flip chip if gold bump diameter and height is 0.001inch. 
 These chips have 1singal pad and 2 ground pad, so I'd like use CPWG on PCB. Maybe chip's bottom is placed upper side without bonding.... 
 Plase let me know if you have information about this. 
 Thank you!

ADIApproved · Accepted Answer

Hi, 
 For the amplifiers, the die bottom is GND which is probably the same with the mixer. If you try to mount the devices upside down, then the backside GND connection will be pure cause the only connection will be through the GND pads. Due to increased GND inductance the performance will not meet what is given on the datasheet. You will probably get amplification up to some point but it will be less than the datasheet specs. 
 One option would be using packaged parts and follow standard SMD mounting process. Both die amps can be replaced with SMD alternatives. But finding an SMD mixer at 70 GHz may not be possible. 
 Best, 
 Kagan)

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Is it passible Wire bonding chips use like flip chip?