The ADL7003 shows there is no DC voltage for the capacitors connected to the B power and gate voltage pins, is this correct?
The only ADL7003 pads requiring connection are shown on the Typical Application Circuit and the Assembly Diagram. The die does have several ground pads, some of which are used during our wafer probe/production test, but none of those ground pads require connection in a customer application. The die fabrication process includes vias which bring the circuit grounds to the backside metal. In your application, that backside metal will serve as the only ground for the die. For best performance you should ensure that the external bypass capacitors make a good, low inductance connection to the ground substrate onto which the backside is attached.