Request for RθJC and RθJB (MAX4003EUA) for Thermal Simulation

Question

Hi, 
 We are currently running a thermal simulation for MAX4003EUA and would appreciate your help to provide the R&theta;JC and R&theta;JB values (&deg;C/W). We couldn&rsquo;t find the R&theta;JC and R&theta;JB data in the MAX4003 datasheet. Could you please share these values with us? 
 Thank you. 
 Best regards,

enash · Answer

I cannot find a specification for the thermal resistance for this part. But I think that the thermal resistance value is not very important because the device consumes so little energy. Power consumption is 30 mW worst case. Because the package does not have a heat slug on its underside, I'm going to assume that the junction to board thermal resistance is quite high. Let's say 200 degC/W for junction to case. This means that the temperature difference from junction to board will be only 6 degrees. So if the board is at 85 degC, the die will be at 86 degrees, well under the abs max ratings limit of 150 degC. The junction to air thermal resistance is also probably in the 200 degC/W range. So if air temperature is 85 degC, the die rise is probably going to be at most 10 degrees higher. So while I cannot give you a number, like I said, I don't think that it matters. If you absolutely need a number, I would use 300 degC/W for junction to case and junction to board. Even with this very conservative number, the temperature rise to the die will be quite small because of the low power consumption.

Popular Forums

Product Forums

Application Forums

Design Center Forums

Highlighted Webinar

Places

Libraries

Latest Webinars

Challenge Yourself!

What's Brewing

Places

Resources

Highlighted Blogs

Latest Blogs

ADI Blogs

Visit ContentZone

Featured Content

View Content By Industry

View Content By Technology

Products Mentioned

Thread Details

Request for RθJC and RθJB (MAX4003EUA) for Thermal Simulation