Post Go back to editing

Thermal Management

Category: Hardware
Product Number: HMC1087F10

What all do people recommend to use for thermal management directly underneath the chip? Just trying to figure out options, does it need to be electrically insulated? I don't think so, you want the chip to make ground, so just curious what others or ADI recommends to place underneath the chip to not mess with it electrically but aide with thermal dissipation. Thanks in advance.

  • For thermal management directly underneath the chip, Analog Devices recommends using thermal vias and copper planes. These can be connected to ground to serve both electrical and thermal purposes. The best reference for what to do is usually the evaluation board. In this case you have a high frequency amplifier that uses a lot of current. So it's important that the interface from the pcb to the metal slug on the underside of the device has low thermal and electrical impdedance.