Hi Team,
I'm working on the PCB design for the HMC8410LP2FE LNA and need the component’s footprint dimensions to complete the layout. I’ve reviewed the datasheet but couldn't find the necessary pad-to-pad spacing or land pattern specifications.
Can you please provide the PCB footprint details—land pattern, solder pad dimensions, solder mask, thermal pad size, and any recommended clearances—at your earliest convenience?
Thankyou.