Category: Hardware
Product Number: ADPA1106
That PCB needs to be at least 0.4mm thick, otherwise the copper coin cannot be pressed in there. I have design files for a PCB with RO4350B of 0.254mm, total board thickness 0.33mm. That's too little.
I can do two things: switch to an RO4350B 0.508mm or add 2x GND inner layers so that FR4 prepreg can be used between non-critical layers to gain thickness.
With a thicker RF dielectric, I need to adjust my microstrip, the trace width becomes larger, and thus the difference compared to the chip solder pads also increases.
Extra ground layers => that means the RF does not directly reach the RF GND (because it is on layer 2 = internal), and must first use a via to get there.