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Request for Thermal Resistance Parameters: Theta-JC and Theta-JB

Category: Hardware
Product Number: Thermal Resisatnce

I would like to know the following thermal resistance parameters for the components listed below:

  1. LTC6433AIUF-15#PBF
  2. ADL8104
  3. LTC5553IUDB#PBF

Specifically, I need the values for:

  • Theta-JC (Junction-to-Case Thermal Resistance)
  • Theta-JB (Junction-to-Board Thermal Resistance)

If these values are not directly available, please advise on how I might estimate or derive them for thermal analysis.

Thank you!

  • Dear ADI Team, 

    I am writing to follow up on my previous request submitted on November 25, 2024, regarding thermal resistance parameters for the following components:

    • LTC6433AIUF-15#PBF
    • ADL8104
    • LTC5553IUDB#PBF

    Specifically, I require the following information for thermal analysis:

    • Theta-JC (Junction-to-Case Thermal Resistance)
    • Theta-JB (Junction-to-Board Thermal Resistance)

    If these values are not directly available, I kindly request guidance on how to estimate or derive them.

    As this data is critical for my design, I would greatly appreciate a response at your earliest convenience. Please let me know if there is any additional information I need to provide to facilitate this process.

    Looking forward to your response.

    Thank you,

  • Hi SANJNAY,

    In my opinion theta JB would not be useful for this of part/application but I can request it (along with JC). These simulation requests typically take ~3 months. I would suggest taking this off of EZ and going through email.

    Thanks,

    Dan

  • Thank you for your earlier response regarding the thermal resistance parameters for the following components:

    • LTC6433AIUF-15#PBF
    • ADL8104
    • LTC5553IUDB#PBF

    As I understand that Theta-JC and Theta-JB simulations may take significant time, I would like to ask if there are any alternative methods or guidelines available for estimating or approximating these thermal resistance parameters using existing data (e.g., package type, material properties, or standard reference values).

    Additionally, if there are any relevant application notes, white papers, or design guidelines that could assist me in performing a thermal analysis for these components, I would greatly appreciate if you could point me toward them.  

    I look forward to your guidance on how best to proceed in the interim.

  • Hey ,

    Here are two application notes we have available that provide further insight into how we calculate thermal resistance. Both notes discuss the parameters Theta JC (junction-to-case thermal resistance) and Theta JA (junction-to-ambient thermal resistance).

    Additionally, in the Thermal Characterization of IC Packages note, there is a reference to JEDEC standards for thermal resistance, which includes a link. You can download the report detailing how Theta JB (junction-to-board thermal resistance) is measured and conducted.

    I hope this information helps clarify the process! Let me know if you need further details.

    Data Sheet Intricacies— Absolute Maximum Ratings and Thermal Resistances | Analog Devices

    Thermal Characterization of IC Packages | Analog Devices

    Regards,

    Dorant