Hi,
Could you please share which material is used to bond PCB to the heat sink?
Regards,
HMC7357
Recommended for New Designs
The HMC7357 is a three-stage GaAs pHEMT MMIC Medium Power Amplifier that operates between 5.5 and 8.5 GHz. The amplifier provides 29 dB of gain and +35...
Datasheet
HMC7357 on Analog.com
Hi,
Could you please share which material is used to bond PCB to the heat sink?
Regards,
GLADION - Moved from Amplifiers to RF and Microwave. Post date updated from Monday, February 12, 2024 6:53 AM UTC to Monday, February 12, 2024 11:42 PM UTC to reflect the move.
Hi mnb123,
It is a solder alloy, 96.5SN, 3.5 AG composition. It is sheet format and is 1.5 mils thick.
Regards,
Jim B
Hi mnb123,
It is a solder alloy, 96.5SN, 3.5 AG composition. It is sheet format and is 1.5 mils thick.
Regards,
Jim B
Thanks Jim.
Hi Jim,
Could you please share the provider and the part number of this alloy?
regards,
Hi,
I've attached the label. The PN isn't printed. It is made by Corning.
Regards,
Jim B